薄ウェハーの世界市場(~2027)

• 英文タイトル:Thin Wafer Market Research Report by Wafer Size, Process, Technology, Application, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19

Thin Wafer Market Research Report by Wafer Size, Process, Technology, Application, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19「薄ウェハーの世界市場(~2027)」(市場規模、市場予測)調査レポートです。• レポートコード:MRC2301H040
• 出版社/出版日:360iResearch / 2022年10月
• レポート形態:英語、PDF、249ページ
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レポート概要
360iResearch社の市場調査レポートでは、2021年の8,389.91百万ドルであった世界の薄ウェハー市場規模が、2022年には9,064.42百万ドルへ到達し、2027年までにCAGR 8.21%増加して13,474.79百万ドルへ成長すると見込まれています。本調査レポートでは、薄ウェハーの世界市場について調査し、序論、調査方法、エグゼクティブサマリー、市場概要、市場インサイト、ウェハーサイズ別(125㎜、200㎜、300㎜)分析、プロセス別(キャリアレス/TAIKOプロセス、仮接着・ディボンディング)分析、技術別(ダイシング、研削、研磨)分析、用途別(CIS(密着イメージセンサー)、インターポーザー、LED、ロジック、その他)分析、地域別(南北アメリカ、アメリカ、カナダ、ブラジル、アジア太平洋、日本、中国、インド、韓国、台湾、ヨーロッパ/中東/アフリカ、イギリス、ドイツ、フランス、ロシア、その他)分析、競争状況、企業情報など、以下の構成でお届けいたします。なお、当レポートに記載されている会社情報には3M Company、Applied Materials, Inc.、Atecom Technology Co., Ltd.、Brewer Science, Inc.、Chipmetrics Oy、Disco Corporation、EV Group、Globalwafers Co., Ltd.、Jurata Thin Film、Lintec Corporation、Mechatronic Systemtechnik、Nissan Chemical Corporation、Okmetic、ROHM CO., LTD.などが含まれています。
・序論
・調査方法
・エグゼクティブサマリー
・市場概
・市場インサイト
・世界の薄ウェハー市場規模:ウェハーサイズ別
- 125㎜薄ウェハーの市場規模
- 200㎜薄ウェハーの市場規模
- 300㎜薄ウェハーの市場規模
・世界の薄ウェハー市場規模:プロセス別
- キャリアレス/TAIKOプロセスにおける市場規模
- 仮接着・ディボンディングにおける市場規模
・世界の薄ウェハー市場規模:技術別
- ダイシングにおける市場規模
- 研削における市場規模
- 研磨における市場規模
・世界の薄ウェハー市場規模:用途別
- CIS(密着イメージセンサー)における市場規模
- インターポーザーにおける市場規模
- LEDにおける市場規模
- ロジックにおける市場規模
- その他用途における市場規模
・世界の薄ウェハー市場規模:地域別
- 南北アメリカの薄ウェハー市場規模
アメリカの薄ウェハー市場規模
カナダの薄ウェハー市場規模
ブラジルの薄ウェハー市場規模
...
- アジア太平洋の薄ウェハー市場規模
日本の薄ウェハー市場規模
中国の薄ウェハー市場規模
インドの薄ウェハー市場規模
韓国の薄ウェハー市場規模
台湾の薄ウェハー市場規模
...
- ヨーロッパ/中東/アフリカの薄ウェハー市場規模
イギリスの薄ウェハー市場規模
ドイツの薄ウェハー市場規模
フランスの薄ウェハー市場規模
ロシアの薄ウェハー市場規模
...
- その他地域の薄ウェハー市場規模
・競争状況
・企業情報

The Global Thin Wafer Market size was estimated at USD 8,389.91 million in 2021 and expected to reach USD 9,064.42 million in 2022, and is projected to grow at a CAGR 8.21% to reach USD 13,474.79 million by 2027.

Market Statistics:
The report provides market sizing and forecast across 7 major currencies – USD, EUR, JPY, GBP, AUD, CAD, and CHF. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2020 are considered as historical years, 2021 as the base year, 2022 as the estimated year, and years from 2023 to 2027 are considered as the forecast period.

Market Segmentation & Coverage:
This research report categorizes the Thin Wafer to forecast the revenues and analyze the trends in each of the following sub-markets:

Based on Wafer Size, the market was studied across 125 mm, 200 mm, and 300 mm.

Based on Process, the market was studied across Carrier-less/Taiko Process and Temporary Bonding & Debonding.

Based on Technology, the market was studied across Dicing, Grinding, and Polishing.

Based on Application, the market was studied across CIS, Interposer, LED, Logic, Memory, MEMS (micro-electromechanical system), and RF Devices.

Based on Region, the market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:
COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Cumulative Impact of 2022 Russia Ukraine Conflict:
We continuously monitor and update reports on political and economic uncertainty due to the Russian invasion of Ukraine. Negative impacts are significantly foreseen globally, especially across Eastern Europe, European Union, Eastern & Central Asia, and the United States. This contention has severely affected lives and livelihoods and represents far-reaching disruptions in trade dynamics. The potential effects of ongoing war and uncertainty in Eastern Europe are expected to have an adverse impact on the world economy, with especially long-term harsh effects on Russia.This report uncovers the impact of demand & supply, pricing variants, strategic uptake of vendors, and recommendations for Thin Wafer market considering the current update on the conflict and its global response.

Competitive Strategic Window:
The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:
The FPNV Positioning Matrix evaluates and categorizes the vendors in the Thin Wafer Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:
The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Competitive Scenario:
The Competitive Scenario provides an outlook analysis of the various business growth strategies adopted by the vendors. The news covered in this section deliver valuable thoughts at the different stage while keeping up-to-date with the business and engage stakeholders in the economic debate. The competitive scenario represents press releases or news of the companies categorized into Merger & Acquisition, Agreement, Collaboration, & Partnership, New Product Launch & Enhancement, Investment & Funding, and Award, Recognition, & Expansion. All the news collected help vendor to understand the gaps in the marketplace and competitor’s strength and weakness thereby, providing insights to enhance product and service.

Company Usability Profiles:
The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Thin Wafer Market, including 3M Company, Applied Materials, Inc., Atecom Technology Co., Ltd., Brewer Science, Inc., Chipmetrics Oy, Disco Corporation, EV Group, Globalwafers Co., Ltd., Jurata Thin Film, Lintec Corporation, Mechatronic Systemtechnik, Nissan Chemical Corporation, Okmetic, ROHM CO., LTD., Shin-Etsu Chemical Co., Ltd., Siltronic AG, Siltronix Silicon Technologies, SK Siltron, Sumco Corporation, Synova SA, SÜSS MicroTec SE, Thin Film Equipment S.r.l., Ulvac GmbH, Wafer Works Corporation, and Wafer World Inc..

The report provides insights on the following pointers:
1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:
1. What is the market size and forecast of the Global Thin Wafer Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Thin Wafer Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Thin Wafer Market?
4. What is the competitive strategic window for opportunities in the Global Thin Wafer Market?
5. What are the technology trends and regulatory frameworks in the Global Thin Wafer Market?
6. What is the market share of the leading vendors in the Global Thin Wafer Market?
7. What modes and strategic moves are considered suitable for entering the Global Thin Wafer Market?

レポート目次

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Major trends of compact and reduced sizes of electronic devices
5.1.1.2. Growing implementation of MEMS technology in portable health monitoring devices
5.1.2. Restraints
5.1.2.1. Major issue such as efficiency maintenance for thin wafers
5.1.3. Opportunities
5.1.3.1. Proliferating semiconductor industry in mainly emerging economies
5.1.3.2. Growing focus towards the portable electronic devices
5.1.4. Challenges
5.1.4.1. More vulnerable to damages caused by high pressure
5.2. Cumulative Impact of COVID-19

6. Thin Wafer Market, by Wafer Size
6.1. Introduction
6.2. 125 mm
6.3. 200 mm
6.4. 300 mm

7. Thin Wafer Market, by Process
7.1. Introduction
7.2. Carrier-less/Taiko Process
7.3. Temporary Bonding & Debonding

8. Thin Wafer Market, by Technology
8.1. Introduction
8.2. Dicing
8.3. Grinding
8.4. Polishing

9. Thin Wafer Market, by Application
9.1. Introduction
9.2. CIS
9.3. Interposer
9.4. LED
9.5. Logic
9.6. Memory
9.7. MEMS (micro-electromechanical system)
9.8. RF Devices

10. Americas Thin Wafer Market
10.1. Introduction
10.2. Argentina
10.3. Brazil
10.4. Canada
10.5. Mexico
10.6. United States

11. Asia-Pacific Thin Wafer Market
11.1. Introduction
11.2. Australia
11.3. China
11.4. India
11.5. Indonesia
11.6. Japan
11.7. Malaysia
11.8. Philippines
11.9. Singapore
11.10. South Korea
11.11. Taiwan
11.12. Thailand
11.13. Vietnam

12. Europe, Middle East & Africa Thin Wafer Market
12.1. Introduction
12.2. Denmark
12.3. Egypt
12.4. Finland
12.5. France
12.6. Germany
12.7. Israel
12.8. Italy
12.9. Netherlands
12.10. Nigeria
12.11. Norway
12.12. Poland
12.13. Qatar
12.14. Russia
12.15. Saudi Arabia
12.16. South Africa
12.17. Spain
12.18. Sweden
12.19. Switzerland
12.20. Turkey
12.21. United Arab Emirates
12.22. United Kingdom

13. Competitive Landscape
13.1. FPNV Positioning Matrix
13.1.1. Quadrants
13.1.2. Business Strategy
13.1.3. Product Satisfaction
13.2. Market Ranking Analysis, By Key Player
13.3. Market Share Analysis, By Key Player
13.4. Competitive Scenario
13.4.1. Merger & Acquisition
13.4.2. Agreement, Collaboration, & Partnership
13.4.3. New Product Launch & Enhancement
13.4.4. Investment & Funding
13.4.5. Award, Recognition, & Expansion

14. Company Usability Profiles
14.1. 3M Company
14.1.1. Business Overview
14.1.2. Key Executives
14.1.3. Product & Services
14.2. Applied Materials, Inc.
14.2.1. Business Overview
14.2.2. Key Executives
14.2.3. Product & Services
14.3. Atecom Technology Co., Ltd.
14.3.1. Business Overview
14.3.2. Key Executives
14.3.3. Product & Services
14.4. Brewer Science, Inc.
14.4.1. Business Overview
14.4.2. Key Executives
14.4.3. Product & Services
14.5. Chipmetrics Oy
14.5.1. Business Overview
14.5.2. Key Executives
14.5.3. Product & Services
14.6. Disco Corporation
14.6.1. Business Overview
14.6.2. Key Executives
14.6.3. Product & Services
14.7. EV Group
14.7.1. Business Overview
14.7.2. Key Executives
14.7.3. Product & Services
14.8. Globalwafers Co., Ltd.
14.8.1. Business Overview
14.8.2. Key Executives
14.8.3. Product & Services
14.9. Jurata Thin Film
14.9.1. Business Overview
14.9.2. Key Executives
14.9.3. Product & Services
14.10. Lintec Corporation
14.10.1. Business Overview
14.10.2. Key Executives
14.10.3. Product & Services
14.11. Mechatronic Systemtechnik
14.11.1. Business Overview
14.11.2. Key Executives
14.11.3. Product & Services
14.12. Nissan Chemical Corporation
14.12.1. Business Overview
14.12.2. Key Executives
14.12.3. Product & Services
14.13. Okmetic
14.13.1. Business Overview
14.13.2. Key Executives
14.13.3. Product & Services
14.14. ROHM CO., LTD.
14.14.1. Business Overview
14.14.2. Key Executives
14.14.3. Product & Services
14.15. Shin-Etsu Chemical Co., Ltd.
14.15.1. Business Overview
14.15.2. Key Executives
14.15.3. Product & Services
14.16. Siltronic AG
14.16.1. Business Overview
14.16.2. Key Executives
14.16.3. Product & Services
14.17. Siltronix Silicon Technologies
14.17.1. Business Overview
14.17.2. Key Executives
14.17.3. Product & Services
14.18. SK Siltron
14.18.1. Business Overview
14.18.2. Key Executives
14.18.3. Product & Services
14.19. Sumco Corporation
14.19.1. Business Overview
14.19.2. Key Executives
14.19.3. Product & Services
14.20. Synova SA
14.20.1. Business Overview
14.20.2. Key Executives
14.20.3. Product & Services
14.21. SÜSS MicroTec SE
14.21.1. Business Overview
14.21.2. Key Executives
14.21.3. Product & Services
14.22. Thin Film Equipment S.r.l.
14.22.1. Business Overview
14.22.2. Key Executives
14.22.3. Product & Services
14.23. Ulvac GmbH
14.23.1. Business Overview
14.23.2. Key Executives
14.23.3. Product & Services
14.24. Wafer Works Corporation
14.24.1. Business Overview
14.24.2. Key Executives
14.24.3. Product & Services
14.25. Wafer World Inc.
14.25.1. Business Overview
14.25.2. Key Executives
14.25.3. Product & Services

15. Appendix
15.1. Discussion Guide
15.2. License & Pricing




• 英文レポート名:Thin Wafer Market Research Report by Wafer Size, Process, Technology, Application, Region - Global Forecast to 2027 - Cumulative Impact of COVID-19
• 日本語訳:薄ウェハーの世界市場(~2027)
• レポートコード:MRC2301H040お問い合わせ(見積依頼・ご注文・質問)